Archive for the 'ESG' Category
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August 06, 2025
Three New Technologies for Raising the Performance Ceiling on Custom Compute
By Michael Kanellos, Head of Influencer Relations, Marvell
More customers, more devices, more technologies, and more performance—that, ultimately, is where custom silicon is headed. While Moore’s Law is still alive, customization is taking over fast as the engine for driving change, innovation and performance in data infrastructure. A growing universe of users and chip designers are embracing the trend and if you want to see what’s at the cutting edge of custom, the best chips to study are the compute devices for data centers, i.e. the XPUs, CPUs, and GPUs powering AI clusters and clouds. By 2028, custom computing devices are to account for $55 billion in revenue, or 25% of the market.1 Technologies developed for this segment will trickle down into others.
Here are three of the latest innovations from Marvell:
Multi-Die Packaging with RDL Interposers
Achieving performance and power gains by shrinking transistors is getting more difficult and expensive. “There has been a pretty pronounced slowing of Moore’s Law. For every technology generation we don’t get the doubling (of performance) that we used to get,” says Marvell’s Mark Kuemerle, Vice President of Technology, Custom Cloud Solutions. “Unfortunately, data centers don’t care. They need a way to increase performance every generation.”
Instead of shrinking transistors to get more of them into a finite space, chiplets effectively allow designers to stack cores on top of each other with the packaging serving as the vertical superstructure.
2.5D packaging, debuted by Marvell in May, increases the effective amount of compute silicon for a given space by 2.8 times.2 At the same time, the RDL interposer wires them in a more efficient manner. In conventional chiplets, a single interposer spans the floor space of the chips it connects as well as any area between them. If two computing cores are on opposite sides of a chiplet package, the interposer will cover the entire space.
Marvell® RDL interposers, by contrast, are form-fitted to individual computing die with six layers of interconnects managing the connections.
2.5D and multilayer packaging. With current manufacturing technologies, chips can achieve a maximum area of just over 800 sq. mm. By stacking them, the total number of transistors in an XY footprint can grow exponentially. Within these packages, RDL interposers are the elevator shafts, providing connectivity between and across layers in a space-efficient manner.
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July 15, 2025
Sustainable Computing With CXL: How Marvell Structera X Can Help Eliminate Waste, Expand Capacity, Lower Emissions
By Khurram Malik, Senior Director of Product Marketing, Marvell
As AI, cloud computing, and high-performance workloads continue to grow rapidly, data centers are accelerating their infrastructure upgrades. Central to this transformation is the migration to DDR5 memory, designed to meet the increasing demands for bandwidth and speed in servers.
This shift, however, comes with a significant challenge: millions of fully functional DDR4 memory modules, the dominant memory inside today’s servers, could be retired prematurely. This is not because of a performance failure. DDR4 memory modules can operate for a decade or longer. Instead, it is because the latest generation of server CPUs only support DDR5 memory. Put another way, when hyperscalers replace their current servers with DDR5 modules over the coming years, they will be potentially throwing away billions of GBs of fully functional DDR4 memory if they can’t find ways to use them.
The result is a looming e-waste problem and an environmental impact that cannot be ignored. Up to 66 billion kilograms of CO₂ emissions—approximately the same amount that would be generated by 168 billion miles of driving1-- and thousands of tons of e-waste can be avoided by giving DDR4 a second life. Marvell® CXL Structera™ X presents a powerful solution by extending the life of DDR4 memory, enabling data centers to reuse these existing assets, reduce capital expenditures, and minimize their carbon footprint—all while improving the performance footprint of their infrastructure.
Marvell CXL Structera X: A Pathway for More Memory
Released last year, Marvell Structera CXL devices effectively allow cloud operators and system designers to add extra memory, memory bandwidth, and/or computing cores to servers by transforming an open PCIe interface into a memory channel. A first-of-its kind device, the Structera A memory accelerator provides a path for adding up to 16 server CPU cores, 200Gb of memory bandwidth and 4TB of memory for offloading the processing of deep learning recommendation models (DLRM) and other tasks for CPUs.
Structera X, meanwhile, focuses on maximizing capacity. A single Structera X 2404 is capable of supporting up to 12 DDR4 additional DIMMs, or 6TB memory capacity without compression, or up to 12TB with LZ4 inline compression in a single one- or two-processor server. It is also the first CXL device to be compatible with both DDR4 or DDR5. As a result, Structera X becomes a conduit for recycling DDR4. The diagram shows more:
Financially, reusing memory is a boon. July 2025 spot prices for 96GB DIMMs of DDR5 memory range from $458 to $488.2 Repurposing TBs of otherwise-to-be-discarded DDR4 instead of buying new DDR5 means thousands of dollars saved per CXL-enhanced server.
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December 18, 2023
Sustainability as an Opportunity for Semiconductor Product Innovation
By Alua Suleimenova, ESG Program Manager, Marvell
The annual United Nations Climate Change Conference COP28 taking place this year in Dubai has brought technology under the sustainability spotlight. In an era of rapid technological advancement, digitalization and proliferation of AI, environmental impacts of technology cannot be overlooked. The semiconductor industry is now at a unique juncture: the global demand for semiconductor products is growing rapidly alongside increasing pressure to reduce greenhouse gas (GHG) emissions.
Reducing emissions from semiconductor product manufacturing remains the most effective and preferred response measure to climate change for many companies. At the same time, addressing upstream climate impacts alone would not represent a comprehensive picture. Semiconductor companies are increasingly embracing sustainable product design and prioritize power reduction both intrinsically in the products themselves and extrinsically - by collaborating with their customers around energy efficiency in the data infrastructure systems in which the semiconductor products are deployed.
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March 21, 2023
New Goals Demonstrate Marvell’s Commitment to ESG
By Rebecca O'Neill, Global Head of ESG, Marvell
Marvell recently released its inaugural Environmental, Social and Governance (ESG) Report, detailing the company's goals, strategic approach, and commitment to building a sustainable future. Marvell's approach is based on the areas of greatest impact and opportunity for our company: integrating environmental and social considerations into our product design and responsibly managing the impacts of our supply chain, while focusing on strategic ESG initiatives that are material to our financial performance and long-term value creation.
Part of our overarching commitment to address ESG topics involves continuous improvement. That’s why Marvell has set a range of goals that showcase key areas of focus for our business, now and in the future.
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February 08, 2023
Marvell’s Commitment to Inclusion and Diversity
By Rebecca O'Neill, Global Head of ESG, Marvell
Marvell is committed to fostering an inclusive, diverse, and engaging workplace to fully leverage the perspectives and contributions of every individual at the company. We strive to create an environment where people feel fulfilled, inspired, and motivated to learn and grow, personally and professionally.
What Inclusion and Diversity Means to Marvell
Inclusion means focusing on respect, acceptance, and the ability to appreciate a culture-add approach where we can all bring our full authentic selves to work, every day.To us, diversity means valuing differences. We value the unique perspectives and experiences of every employee. It is this uniqueness that every employee brings to the company, which is powerful and provides us with a competitive advantage.
Our Strategy
We have developed a strategy focused on four Inclusion & Diversity business outcomes:
Recent Posts
- Chiplets Turn 10: Here are Ten Things to Know
- Three New Technologies for Raising the Performance Ceiling on Custom Compute
- Sustainable Computing With CXL: How Marvell Structera X Can Help Eliminate Waste, Expand Capacity, Lower Emissions
- Inside Marvell’s Expanding Custom Silicon Opportunity
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