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Latest Marvell Blog Articles

  • January 20, 2026

    Co-Packaged Copper Extending Its Reach Inside Scale-Up Networks

    By Rohan Gandhi, Director of Product Management for Switching Products, Marvell

    Power and space are two of the most critical resources in building AI infrastructure. That’s why Marvell is working with cabling partners and other industry experts to build a framework that enables data center operators to integrate co-packaged copper (CPC) interconnects into scale-up networks.

    Unlike traditional printed circuit board (PCB) traces, CPCs aren’t embedded in circuit boards. Instead, CPCs consist of discrete ribbons or bundles of twinax cable that run alongside the board. By taking the connection out of the board, CPCs extend the reach of copper connections without the need for additional components such as equalizers or amplifiers as well as reduce interference, improve signal integrity, and lower the power budget of AI networks. 

    Being completely passive, CPCs can’t match the reach of active electrical cables (AECs) or optical transceivers. They extend farther than traditional direct attach copper (DAC) cables, making them an optimal solution for XPU-to-XPU connections within a tray or connecting XPUs in a tray to the backplane. Typical 800G CPC connections between processors within the same tray span a few hundred millimeters while XPU-to-backplane connections can reach 1.5 meters. Looking ahead,1.6T CPCs based around 200G lanes are expected within the next two years, followed by 3.2T solutions. 

    While the vision can be straightforward to describe, it involves painstaking engineering and cooperation across different ecosystems. Marvell has been cultivating partnerships to ensure a smooth transition to CPCs as well as create an environment where the technology can evolve and scale rapidly.  

  • January 12, 2026

    Active Copper Cables: A New Class of Rack Interconnects for Further Optimizing AI

    By Nicola Bramante, Senior Principal Engineer, Connectivity Marketing, Marvell

    The exponential growth in AI workloads drives new requirements for connectivity in terms of data rate, associated bandwidth and distance, especially for scale-up applications. With direct attach copper (DAC) cables reaching their limits in terms of bandwidth and distance, a new class of cables, active copper cables (ACCs), are coming to market for short-reach links within a data center rack and between racks. Designed for connections up to 2 to 2.5 meters long, ACCs can transmit signals further than traditional passive DAC cables in the 200G/lane fabrics hyperscalers will soon deploy in their rack infrastructures.

    At the same time, a 1.6T ACC consumes a relatively miniscule 2.5 watts of power and can be built around fewer and less sophisticated components than longer active electrical cables (AECs) or active optical cables (AOCs). The combination of features gives ACCs a peak mix of bandwidth, power, and cost for server-to-server or server-to-switch connections within the same rack.

    Marvell announced its first ACC linear equalizers for producing ACC cables last month. 

    Inside the Cable

    ACCs effectively integrate technology originally developed for the optical realm into copper cables. The idea is to use optical technologies to extend bandwidth, distance and performance while taking advantage of copper’s economics and reliability. Where these ACCs differ is in the components added to them and the way they leverage the technological capabilities of a switch or other device to which they are connected.

    ACCs include an equalizer that boosts signals received from the opposite end of the connection. As analog devices, ACC equalizers are relatively inexpensive compared to digital alternatives, consume minimal power and add very little latency.

     

  • December 16, 2025

    Custom Silicon: A Sea Change for Semiconductors

    By Sandeep Bharathi, president, Data Center Group, Marvell

    This blog was originally posted at Fortune.

    Semiconductors have transformed virtually every aspect of our lives. Now, the semiconductor industry is on the verge of a profound transformation itself.

    Customized silicon—chips uniquely tailored to meet the performance and power requirements of an individual customer for a particular use case—will increasingly become pervasive as data center operators and AI developers seek to harness the power of AI. Expanded educational opportunities, better decision making, ways to improve the sustainability of the planet all become possible if we get the computational infrastructure right.

    The turn to custom, in fact, is already underway. The number of GPUs—the merchant chips employed for AI training and inference—produced today is nearly double the number of custom XPUs built for the same tasks. By 2028, custom accelerators will likely pass GPUs in units shipped, with the gap expected to grow.

    Custom AI accelerators are expected to pass GPUs in unit shipments

  • December 03, 2025

    Marvell Named to America’s Most Responsible Companies 2026 List

    By Vienna Alexander, Marketing Content Professional, Marvell

    Marvell has been named in Newsweek and Statista’s list of America’s Most Responsible Companies for 2026. This is the second consecutive year Marvell has been recognized as one of America’s Most Responsible Companies, demonstrating an ongoing commitment to sustainable excellence and social responsibility. It is a testament to the company’s dedication to doing what’s right—from environmental initiatives and community support to sustainable product design and responsible operations.

  • December 02, 2025

    5 Times More Queries per Second: What CXL Compute Accelerators Can Do for AI

    By Khurram Malik, Senior Director of Marketing, Custom Cloud Solutions, Marvell

    Near-memory compute technologies have always been compelling. They can offload tasks from CPUs to boost utilization and revenue opportunities for cloud providers. They can reduce data movement, one of the primary contributors to power consumption,1  while also increasing memory bandwidth for better performance.  

    They have also only been deployed sporadically; thermal problems, a lack of standards, cost and other issues have prevented many of these ideas giving developers that goldilocks combination of wanted features that will jumpstart commercial adoption.2

    This picture is now changing with CXL compute accelerators, which leverage open standards, familiar technologies and a broad ecosystem. And, in a demonstration at OCP 2025, Samsung Electronics, software-defined composable solution provider Liqid, and Marvell showed how CXL accelerators can deliver outsized gains in performance.

    The Liqid EX5410C is a demonstration of a CXL memory pooling and sharing appliance capable of scaling up to 20TB of additional memory. Five of the 4RU appliances can then be integrated into a pod for a whopping 100TB of memory and 5.1Tbps of additional memory bandwidth. The CXL fabric is managed by Liqid’s Matrix software that enables real-time and precise memory deployment based on workload requirements: 

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