Marvell Introduces 1.6 Tbps LPO Chipset to Enable Optical Short-reach, Scale-up Compute Fabric Interconnects
Addresses the Speed and Reach Limitations of Passive, Direct-attached Copper (DAC) Cables
SANTA CLARA, Calif. —Dec. 10, 2024 — Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced the general availability of a 200G per lane optimized transimpedance amplifier (TIA) and laser driver chipset, enabling 800 Gbps and 1.6 Tbps linear-drive pluggable optics (LPO). Designed to address next-generation short-reach, scale-up compute fabric connectivity requirements, LPO modules enabled by the chipset overcome the reach limitations of passive, DAC cable interconnects. The LPO chipset expands the industry-leading interconnect portfolio from Marvell, which includes PAM4 optical DSPs, coherent DSPs, data center interconnects, Alaska® A active electrical cable (AEC) DSPs and Alaska P PCIe retimers, delivering an optimized optical solution for short-reach compute fabric connections, delivering an optimized optical solution for short-reach compute fabric connections.
As artificial intelligence (AI) technologies advance, the demand for higher-bandwidth interconnects in data center networks is accelerating rapidly. This is particularly evident in compute fabric networks, which connect XPUs within and across racks. The next generation of XPU compute fabric networks will transition to data rates of 200 Gbps per lane, where passive DACs fall short of meeting speed and distance requirements.
To address this, cloud data centers will transition to a new type of interconnect that meets their specific requirements. Marvell introduced Alaska A for customers looking to extend copper capabilities using AECs, while others can leverage specialized LPO modules featuring the Marvell TIA and driver chipset. Designed for short and predictable host channels, these LPO modules enable longer reach, higher bandwidth and improved performance compared to copper interconnects.
“Marvell 1.6 Tbps LPO TIA and laser driver chipset is designed to address the growing demand for short-reach, high-bandwidth interconnect solutions, where passive copper cables are hitting a wall,” said Xi Wang, vice president of product marketing for Optical Connectivity at Marvell. “As AI-driven data centers continue to scale, optimizing interconnect solutions across each layer of the network is becoming increasingly critical. The new LPO chipset complements and expands our industry-leading 1.6 Tbps connectivity portfolio, to address the growing spectrum of interconnects that cloud operators are seeking to optimize.”
“LPO has been a technology in search of the right solution. By optimizing chipsets for short, inside-the-rack connections, Marvell brings clarity and focus to LPO, delivering it in a more compelling and scalable manner,” said Alan Weckel, co-founder of 650 Group. “Marvell’s innovative approach to achieving performance gains helps drive better AI cluster TCO and highlights the industry’s direction in optimizing networking links.”
The 1.6 Tbps LPO chipset, one of the latest additions to the Marvell interconnect portfolio, is optimized for specific use cases to help data centers maximize infrastructure utilization and performance while reducing overall cost and power per bit. This extensive portfolio spanning optical and copper interconnects includes Ara, the industry’s first 3nm PAM4 interconnect platform; Aquila, the industry’s first O-band-optimized coherent-lite DSP platform; Nova family of PAM4 DSPs featuring 200 Gbps electrical and optical interfaces; and Alaska A PAM4 DSP for active electrical cables.
LPO Chipset Key Features
- TIA provides best-in-class linearity, power and BER for AI applications.
- Laser driver to improve module performance margin while reducing overall transceiver module design complexity, power consumption, and TCO.
- TIA and laser driver chipset provide adjustable equalization to compensate for channel loss.
マーベルについて
世界をつなぐデータインフラ技術をお届けするために、お客様とのパートナーシップという最も強力な基盤の上に ソリューションを構築しています。 25年以上にわたって世界的な大手テクノロジー企業に信頼されてきた当社は、顧客の現在のニーズ、将来の展望に合わせて設計したセミコンダクターソリューションにより、世界中のデータを動かし、保存し、処理し、さらに保護しています。 深い協働と透明性を通じて、私たちは明日のエンタープライズ、クラウド、自動車およびキャリアアーキテクチャの変革を究極的により良い方向へと変えていきます。
###
これ以外の名前やブランド名についてはそれぞれ各社の所有物としてその権利を主張される場合があります。マーベルの商標のリストについては、www.marvell.comを参照してください。 これ以外の名前やブランド名についてはそれぞれ各社の所有物としてその権利を主張される場合があります。
このプレスリリースには、リスクや不確実性のある連邦証券法の意味における将来の見通しに関する記述が含まれています。 Forward-looking statements include, without limitation, any statement that may predict, forecast, indicate or imply future events, results or achievements. Actual events, results or achievements may differ materially from those contemplated in this press release. Forward-looking statements are only predictions and are subject to risks, uncertainties and assumptions that are difficult to predict, including those described in the “Risk Factors” section of our Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q and other documents filed by us from time to time with the SEC. Forward-looking statements speak only as of the date they are made. Readers are cautioned not to put undue reliance on forward-looking statements, and no person assumes any obligation to update or revise any such forward-looking statements, whether as a result of new information, future events or otherwise.
For further information, contact:
Kim Markle
pr@marvell.com
