The OFC 2025 event in San Francisco was so vast that it would be easy to miss a few stellar demos from your favorite optical networking companies. That’s why we took the time to create videos featuring the latest Marvell technology.
Put them all together and you have a wonderful film festival for technophiles. Enjoy!
We spoke with Kishore Atreya, Senior Director of Cloud Platform Marketing at Marvell, who discussed co-packaged optics. Instead of moving data via electrons, a light engine converts electrical signals into photons—unlocking ultra-high-speed, low-power optical data transfer.
The 1.6T and 6.4T light engines from Marvell can be integrated directly into the chip package, minimizing trace lengths, reducing power and enabling true plug-and-play fiber connectivity. It is flexible, scalable, and built for switching, XPUs, and beyond.
Annie Liao — Product Management Director, Connectivity Marketing at Marvell — showcased how PCIe Gen6 signals can be converted to optical—extending trace length beyond traditional electrical limitations. The result? A 10-meter cable reach spanning across multiple racks. Whether connecting GPUs, accelerators, or storage across racks, this kind of extended PCIe connectivity is critical for building the infrastructure that powers advanced AI workloads.
Michael Kanellos — Director of Content Marketing and Analyst Relations at Marvell — gave an overview of three demos with our partner TeraHop:
Kanellos also met with Lumentum CTO Matthew Sysak to showcase the industry's first 450G on a single wavelength—using Marvell 400G/per lane PAM4 technology operating at 225 Gbaud with Lumentum’s indium phosphide monolithically-integrated DFB-MZI optical transmitter.
This level of performance would've been unthinkable just a few years ago when 100G PAM4 was considered cutting-edge. Now, hitting 450G with a clean waveform marks a truly revolutionary step forward for the industry.
Not to be outdone, Gopalan Iyengar, R&D Optical Engineer from Lumentum, explained how the new 450GB/225GB DFB-MZI laser developed in partnership with Marvell achieves unprecedented data rates. A clean eye diagram demonstrates superior signal quality at 225 PAM-4 Gigabaud / 450 Gbps speeds. This technology is positioned as a promising solution for 3.2T and future high-speed applications.
George Hervey, Senior Director of Switch Product Marketing from Marvell, explained how new co-package copper design moves high-speed escape to substrate top via flyover wires, extending passive copper life within racks The 224G-ready liquid cooling solution enables efficient rack-scale deployment in 1U form factor. Co-package optics technology allows scaling to 1,000-2,000 node clusters with single-layer switching across multiple racks.
In another great partnership, Marvell and Coherent showcased a 1.6T optical solution combining 3nm DSP and silicon photonics—setting new benchmarks in power and performance. Chengpin Yu, Senior Director of Transceiver Engineering at Coherent, showcased the Marvell® Ara 3nm 1.6T PAM4 DSP with Coherent's silicon photonics chip. This kind of efficiency and innovation sets a new bar for 1.6T module development.
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