Posts Tagged 'Meta Connectivity'
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December 19, 2024
Custom, Copper and Cross-Country Connectivity: Eight Big Trends for Marvell in 2024
By Michael Kanellos, Head of Influencer Relations, Marvell
What happened in semis and accelerated infrastructure in 2024? Here is the recap:
1. Custom Controls the Future
Until relatively recently, computing performance was achieved by increasing transistor density à la Moore’s Law. In the future, it will be achieved through innovative design, and many of those innovative design ideas will come to market first—and mostly— through custom processors tailored to use cases, software environments and performance goals thanks to a convergence of unusual and unstoppable forces1 that quietly began years ago.
- At Marvell AI Day, we announced that custom processors would represent 25% of the AI accelerator market by 2028 and exceed $42 billion. We also announced we had secured four designs with three of the major hyperscalers.
- In July, we unveiled StructeraTM A and Structera X,2 CXL controllers for near memory compute and increasing memory capacity, respectively. Merchant and custom versions of the chips were released at the same time, a reverse of the traditional pattern where custom chips might follow merchant ones by a lengthy lag.
- At OCP, Meta showed off FBNIC, a custom network interface developed in collaboration with Marvell to reduce the time needed to resolve network issues.3 Make that four out of four hyperscalers. See the image below.
FB NIC on display at OFC- In December, we announced a five-year collaboration that includes supplying custom AI products and other devices for AWS.4 The collaboration also encompasses performing semiconductor design tasks in the cloud, which promises to reduce the time and cost of creating new chips.
- Finally, we ended the year with an alliance for custom high bandwidth memory with Micron, Samsung Electronics, and SK hynix.5 Custom HBM can reduce chip real estate by up to 25% and increase memory capacity by up to 33%.6 Custom HBM runs against industry orthodoxy,7 writes analyst Joseph Byrne, but it could pay dividends.
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February 24, 2022
マーベル、クラウドとワイヤレス・コンピューティング・アーキテクチャのベスト・オブ・ベストを使用した、エコシステム・パートナーによる妥協のない新しいオープンRANソリューションを展示
By Peter Carson, Senior Director Solutions Marketing, Marvell
Marvell’s 5G Open RAN architecture leverages its OCTEON Fusion processor and underscores collaborations with Arm and Meta to drive adoption of no-compromise 5G Open RAN solutions
The wireless industry’s no-compromise 5G Open RAN platform will be on display at Mobile World Congress 2022. The Marvell-designed solution builds on its extensive compute collaboration with Arm and raises expectations about Open RAN capabilities for ecosystem initiatives like the Meta Connectivity Evenstar program, which is aimed at expanding the global adoption of Open RAN. Last year at MWC, Marvell announced it had joined the Evenstar program [read more]. This year, Marvell’s new 5G Open RAN Accelerator will be on display at the Arm booth at MWC 2022. The OCTEON Fusion processor, which integrates 5G in-line acceleration and Arm Neoverse CPUs, is the foundation for Marvell’s Open RAN DU reference design.
5G is going mainstream with the rapid rollout of next generation networks by every major operator worldwide. The ability of 5G to reliably provide high bandwidth and extremely low latency connectivity is powering applications like metaverse, autonomous driving, industrial IoT, private networks, and many more. 5G is a massive undertaking that is set to transform entire industries and serve the world’s diverse connectivity needs for years to come. But the wireless networks at the center of this revolution are, themselves, undergoing a major transformation – not just in feeds and speeds, but in architecture. More specifically, significant portions of the 5G radio access network (RAN) are moving into the cloud.
