

Hamid R. Azimi is Senior Vice President of Advanced Packaging and Foundry at Marvell. In this role, he leads the development and deployment of next-generation packaging technologies and foundry strategies to support Marvell’s data infrastructure products.
Prior to joining Marvell, Hamid spent nearly 30 years at Intel, where he most recently served as Corporate Vice President and Director of Substrate Packaging Technology Development. He led global R&D and manufacturing teams and delivered industry-leading innovations including die-embedded panel level fanout, EMIB and glass packaging for AI and high-performance computing.
A recognized pioneer in semiconductor packaging, Hamid holds over 40 U.S. patents, including the patent on first-generation organic flip-chip ABF-based substrate. He has received multiple Intel Achievement Awards and is widely known for building high-performing, inclusive teams and mentoring future industry leaders.
Hamid earned a Ph.D. and M.S. in Materials Science from Lehigh University and a B.S. in Materials Engineering from Sharif University of Technology.
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